公 司 简 介

金朋(上海)有限公司是一家美国在华从事电子芯片封装与测试技术的独资企业，注册资金8510万美元，总投资近11亿美元。公司系美国上市公司，总部位于美国加州硅谷域内，在世界上众多国家和地区拥有分公司或销售代表机构。金朋集团（ChipPAC)以世界级的生产技术、设备和技术实力，目前在同行业中位居世界第三。

公司位居上海西郊经济技术开发区，距上海虹桥机场仅8公里之遥。公司现有员工1600多人，占地面积11万平方米。

我们竭诚欢迎四方仁人之士，有识之才垂询本公司。愿您在此职业沃土天地之间，或即可有所效力，或一展鸿图。用您的爱心向世界奉上一颗颗奔腾之“芯”。

ChipPAC (Shanghai) Co. Ltd. (CPS) is a solely foreign-owned American manufacturing enterprise that is engaged in electronic chip assembly and test business in China. The company was grown out of Hyundai Electronic (Shanghai) Co. Ltd. in 1997 when the predecessor was emerged by the parent ChipPAC, USA and remolded into a high-tech manufacturer, whose current registered capital and total investment has reached US$85.1 millions and US$1.1 billions respectively. The headquarters of the consortium is located in the Sillicon Valley, USA, with its branches and sales representative offices scattering all over the world in the countries such as South Korea, Malaysia, PR China and The Netherlands, Japan, Singapore as well. The company has already got itself listed in US NASDAQ Securities Market and gone into a business partnership with Intel

ChipPAC (Shanghai) Co. Ltd. lies in Shanghai Xi Jiao Economic & Technological Developing Zone, only 8 kilometers away from Shanghai Hongqiao Airport. The company occupies an area of 110,000 sq. meters in total and employs 1,600 employees.

The company is fully committed to its established mission aiming at obtaining a sustained growth in business with a team focused on Operational Excellence and weighing up its performance by the criteria of the complete satisfaction of both its customers and employees. By utilizing the most advanced packing and test technology, equipment and expertise, the company has been ranked the third biggest so far in its industrial spectrum.